TGV-SLE System (Through Glass Vias) mittels SLE (Selective Laser Etching) - PR1008634 - 2590 -W

<div class="h1">Titel</div> <div class="pre">TGV-SLE System (Through Glass Vias) mittels SLE (Selective Laser Etching) - PR1008634 - 2590 -W</div> <div class="h1">Beschreibung</div> <div class="pre">Die Anlage soll unter anderem die Laserstrukturierung von TGVs (Through Glass Vias) mittels SLE (Selective Laser Etching) in großformatigem (515mm x 515mm) Dünnglas, insbesondere D263Teco und B33, ermöglichen.</div> <div class="h1">Interne Kennung</div> <div class="pre">LOT-0000</div>