Ausschreibung

Clustertool for Ion Beam Etching of 300mm wafers

AusfĂĽhrung:

Sachsen

Frist:

20.03.2026 12:00 Uhr

Leistungsbeschreibung:

<div class="h1">Titel</div> <div class="pre">Clustertool for Ion Beam Etching of 300mm wafers</div> <div class="h1">Beschreibung</div> <div class="pre">The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. Therefore, it is necessary to fulfill require-ments regarding metal contamination and particle generation compatible with industry standards.</div> <div class="h1">Interne Kennung</div> <div class="pre">0001</div>

Zusammenfassung:

Tätigkeiten:

Details:

  • Auftraggeber
  • AusfĂĽhrungsfristen
  • Vergabeunterlagen
  • Bekanntmachungstext
  • Und vieles mehr …
oder:
Id: wsKj7GIwMP